![PDF] Thermomigration of Cu–Sn and Ni–Sn intermetallic compounds during electromigration in Pb-free SnAg solder joints | Semantic Scholar PDF] Thermomigration of Cu–Sn and Ni–Sn intermetallic compounds during electromigration in Pb-free SnAg solder joints | Semantic Scholar](https://d3i71xaburhd42.cloudfront.net/3f382583ebd3ba8167f02446bc0b5018b252bab8/5-Figure5-1.png)
PDF] Thermomigration of Cu–Sn and Ni–Sn intermetallic compounds during electromigration in Pb-free SnAg solder joints | Semantic Scholar
![Effects of Ag addition and Ag3Sn formation on the mechanical reliability of Ni/Sn solder joints - ScienceDirect Effects of Ag addition and Ag3Sn formation on the mechanical reliability of Ni/Sn solder joints - ScienceDirect](https://ars.els-cdn.com/content/image/1-s2.0-S0026271417302007-fx1.jpg)
Effects of Ag addition and Ag3Sn formation on the mechanical reliability of Ni/Sn solder joints - ScienceDirect
![Homogeneous (Cu, Ni)6Sn5 intermetallic compound joints rapidly formed in asymmetrical Ni/Sn/Cu system using ultrasound-induced transient liquid phase soldering process - ScienceDirect Homogeneous (Cu, Ni)6Sn5 intermetallic compound joints rapidly formed in asymmetrical Ni/Sn/Cu system using ultrasound-induced transient liquid phase soldering process - ScienceDirect](https://ars.els-cdn.com/content/image/1-s2.0-S1350417717305680-gr4.jpg)
Homogeneous (Cu, Ni)6Sn5 intermetallic compound joints rapidly formed in asymmetrical Ni/Sn/Cu system using ultrasound-induced transient liquid phase soldering process - ScienceDirect
![Figure 2.6 from Pressure dependence of the SnP phase diagram and investigations in the ternary system | Semantic Scholar Figure 2.6 from Pressure dependence of the SnP phase diagram and investigations in the ternary system | Semantic Scholar](https://d3i71xaburhd42.cloudfront.net/dfaafeeb66f3067322490dd62ab6866260e4bb09/20-Figure2.6-1.png)
Figure 2.6 from Pressure dependence of the SnP phase diagram and investigations in the ternary system | Semantic Scholar
![A comparative study of Cn/Sn/Cu and Ni/Sn/Ni solder joints for low temperature stable transient liquid phase bonding - ScienceDirect A comparative study of Cn/Sn/Cu and Ni/Sn/Ni solder joints for low temperature stable transient liquid phase bonding - ScienceDirect](https://ars.els-cdn.com/content/image/1-s2.0-S1359646215003231-fx1.jpg)
A comparative study of Cn/Sn/Cu and Ni/Sn/Ni solder joints for low temperature stable transient liquid phase bonding - ScienceDirect
![Effect of Zn content on interfacial reactions of Ni/Sn–xZn/Ni joints under temperature gradient | Journal of Materials Research | Cambridge Core Effect of Zn content on interfacial reactions of Ni/Sn–xZn/Ni joints under temperature gradient | Journal of Materials Research | Cambridge Core](https://static.cambridge.org/binary/version/id/urn:cambridge.org:id:binary-alt:20170927065821-36343-mediumThumb-S0884291417003466_fig7g.jpg?pub-status=live)
Effect of Zn content on interfacial reactions of Ni/Sn–xZn/Ni joints under temperature gradient | Journal of Materials Research | Cambridge Core
![Current-induced interfacial reactions in Ni/Sn–3Ag–0.5Cu/Au/Pd(P)/Ni–P flip chip interconnect | Journal of Materials Research | Cambridge Core Current-induced interfacial reactions in Ni/Sn–3Ag–0.5Cu/Au/Pd(P)/Ni–P flip chip interconnect | Journal of Materials Research | Cambridge Core](https://static.cambridge.org/content/id/urn%3Acambridge.org%3Aid%3Aarticle%3AS0884291411003736/resource/name/S0884291411003736_figAb.gif?pub-status=live)